Principal Thermal Mechanical Photonic Designer

We are seeking a Principal Thermal Mechanical Photonic Designer to lead the thermal and mechanical design of next-generation silicon photonic devices and high-speed optical interconnects. In this role, you will work at the intersection of photonics, packaging, thermal engineering, and mechanical simulation to develop advanced optical solutions for AI infrastructure, high-performance computing, networking, and data center applications.

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You will collaborate closely with multidisciplinary teams across photonics, packaging, systems, reliability, and manufacturing to develop robust, manufacturable, and high-performance photonic products from concept through volume production.

Key Responsibilities

• Lead the thermal and structural design of silicon photonic devices and optical packaging solutions.
• Perform thermo-mechanical and stress simulations for optical components, fiber alignment, and package assemblies, recommending design improvements for performance and manufacturability.
• Develop experimental methodologies for thermal characterization, reliability testing, and laser performance validation under varying environmental and mechanical conditions.
• Model silicon die-to-package thermo-mechanical interactions to predict reliability and optimize package performance.
• Analyze solder joint fatigue, creep behavior, and long-term package reliability.
• Support optical and systems engineering teams in developing opto-mechanical architectures and package designs.
• Evaluate package reliability during assembly, qualification, and field operation by modeling mechanical stresses, failure mechanisms, and material interactions.
• Analyze moisture-induced (hygroscopic) stresses, crack propagation, and interfacial delamination in advanced electronic and photonic packages.
• Perform multi-physics simulations for wire bonding, wire fusing, and assembly processes.
• Conduct thermal characterization of electronic and photonic packages and develop thermal specifications based on simulation and laboratory validation in accordance with JEDEC standards.
• Collaborate with manufacturing, reliability, and product engineering teams to transition designs into high-volume production.

Qualifications

• Ph.D. in Mechanical Engineering, Electrical Engineering, Physics, Materials Science, or a related technical discipline (or equivalent industry experience).
• 15+ years of experience in thermal, mechanical, or photonic product development.
• 8+ years of experience developing silicon photonics integrated circuits and optical products from concept through high-volume manufacturing.
• Strong background in photonic device packaging, opto-mechanical design, and optical system integration.
• Experience conducting applied research and product development for silicon photonic integrated circuits and optical systems.
• Hands-on experience with silicon photonics devices, testing, and product validation.
• Expertise with Ansys simulation tools for thermal, structural, and multi-physics analysis.
• Experience designing tooling, fixtures, and processes for optical alignment, laser attachment, adhesive bonding, and precision assembly.
• Strong understanding of electronic and photonic package reliability, thermal management, and failure analysis.
• Experience defining system-level performance requirements and component specifications.
• Excellent communication and cross-functional collaboration skills.
• Self-driven, innovative, and capable of leading complex technical projects with minimal supervision.

Preferred Skills

• Finite Element Analysis (FEA) for thermal and structural simulations.
• Multi-physics modeling of photonic and electronic packages.
• JEDEC thermal and reliability standards.
• Advanced optical packaging and fiber alignment techniques.
• Failure analysis, reliability engineering, and materials characterization.
• Product development for AI infrastructure, optical networking, high-performance computing, or data center technologies.

Compensation: Base salary is competitive and determined based on experience, qualifications, location, and internal equity. Equity and a comprehensive benefits package are included.